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Talk / Activity

【Congratulations to Life Chair Professor Chien Ping Lee for being elected as the Academician of Academia Sinica & Chip-based Industrial Innovation Program Launch Workshop】
Date: 2024-07-19

Time:July 24, 2024 ( Wednesday 9:00~11:00am )

Venue:Conference Hall, 1F of CPT Building, NYCU

Sign up:Please sign up before July 23, 2024. Link: https://forms.gle/ZKQZfYzPRBNzuaCZ8

Target Audience:team members of the Chip-based Industrial Innovation Program、Professors and Students of the Colleges and Universities、People from Industry, Government, Academia and Research Circles

 

NYCU ECE is glad to share good news with you:First, Life Chair Professor Chien Ping Lee has been elected as the Academician of Academia Sinica. Second, several projects of Chip-based Industrial Innovation Program have been approved by Taiwan government.

 

To meet the opportunities and challenges posed by future technological transformations, the Executive Yuan has approved the Taiwan Chip-based Industrial Innovation Program and has earmarked a total of NT$300 billion (US$9.3 billion) for the program's implementation between 2024 and 2033. The program's first phase will last for five years and focus on leveraging Taiwan's leading global position in chip manufacture, packaging and testing to develop innovative new applications through integrating silicon chips with critical technologies such as generative AI. By laying the groundwork today for the tech industry of tomorrow, Taiwan can secure its technological strength over the next 10 years and spur on the pace of breakthrough innovation across multiple industries.

 

Given the importance of such setup from the government, several research teams’ projects of NYCU ECE have been approved. It is our great honor to be able to contribute to the promotion of the “Chip-based Industrial Innovation Program “. We will hold a workshop on July 24 (Wednesday 9:00~11:00am ) to invite Life Chair Prof. Chien Ping Lee to share his story, and research project teams will share their insights and expected contributions. Hope it will bring constructive information exchange and potential cooperation possibilities between the teams of Chip-based Industrial Innovation Program and the participants.